Log In

 

Company Name : Toshiba Electronic Devices & Storage Corporation

Wednesday, December 6, 2017 5:15PM IST (11:45AM GMT)

(BW)(TOSHIBA)

Toshiba Electronic Devices & Storage Corporation Introduces New Bluetooth® low energy IC for Automotive Applications


Highly expandable and integrated device will be fully AEC-Q100 qualified


TOKYO, Japan

Toshiba Electronic Devices & Storage Corporationhas announced a new IC that is compliant with Bluetooth® low energy (LE) [1] core specification 4.2 including support for secure connection, LE privacy features and extended packet length support. It is available for use in harsh automotive environments and extended temperature ranges. The mixed-signal TC35679IFTG contains both analog RF and baseband digital parts to provide a complete solution in a single, compact and low-profile, 40-pin 6mm x 6mm x 1mm QFN ‘wettable flank’ package, with a pin pitch of 0.5mm.

 

This press release features multimedia. View the full release here: http://www.businesswire.com/news/home/20171205006519/en/

 

Toshiba Electronic Devices & Storage Corporation: A new Bluetooth(R) low energy IC "TC35679IFTG" for ...

Toshiba Electronic Devices & Storage Corporation: A new Bluetooth(R) low energy IC "TC35679IFTG" for automotive applications. (Photo: Business Wire)

The TC35679IFTG provides Bluetooth® Host Control Interface (HCI) functions alongside low energy GATT profile functions (as defined by Bluetooth®) specifications. The new IC becomes a fully-fledged application processor when used in conjunction with an external non-volatile memory, or can be used in combination with an external host processor.

 

The highly integrated device is based on an Arm® Cortex®-M0 processor and includes a sizeable 384KB of on-board mask ROM to support the Bluetooth® baseband process and a further 192KB of on-board RAM for Bluetooth® application programs and data.

 

A key feature of the TC35679IFTG is its ability to form part of sophisticated systems as a result of 17 General Purpose IO (GPIO) lines and multiple communications options including SPI, I2C and a 921.6kbps, two-channel UART. The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface, 6-channel AD converter and the ability to control the control interface of an optional external power amplifier for applications requiring a longer reach. On chip DC-DC converter or LDO circuits adjust the external voltage supply to the required values on chip.

 

Designed for compliance with AEC-Q100[2], the low energy IC is primarily intended to be used in automotive applications. The wettable flank package simplifies automatic visual inspection needed to deliver the high levels of soldering quality required to withstand vibration experienced in automotive applications.

 

Current applications include remote key systems and reducing cables by providing a reliable wireless connection to sensors. The device will also facilitate remote connection to diagnostic equipment, creating a Bluetooth® 'soft' On-Board Diagnostic (OBD) port, thereby saving the cost and weight of the associated cabling and OBD connector.

 

The TC35679 accepts a wide range of supply voltages (1.8-3.6V) making it suitable for automotive applications. Operating temperature range is -40˚C to 105˚C for input voltages from 2.7V to 3.6V and -40˚C to 85˚C from 1.8V to 3.6V.

 
 

Key Features

- Low power consumption:
3.3 mA (Transmitter operation @3.0 V, Output Power : 0 dBm)
3.3 mA (Receiver operation @3.0 V)
Less than 100nA in deep sleep (@3.0V)
- Receiver sensitivity: -93 dBm
- Supports Bluetooth® LE Ver.4.2 central and peripheral devices
- GATT (Generic Attribute Profile) built in
- Supports servers and client functions defined by GATT
- Wettable flank package
- AEC-Q100 compliant[2]
 

Applications
Bluetooth® low energy communication devices for automotive and industrial applications.

 
 

Main Specifications

Part Number   TC35679IFTG
Operating voltage range   1.8V to 3.6V
Current consumption in TX operation   3.3 mA (@3.0 V, Output Power : 0 dBm )
Current consumption in RX operation   3.3 mA (@3.0V)
Current consumption in deep sleep   Less than 100nA (@3.0V)
Operating temperature range  

-40°C to 85 °C (1.8 to 3.6V)
-40°C to 105 °C (2.7 to 3.6V)

Package   QFN40 6 mm x 6 mm 0.5 mm pitch, wettable flank
Wireless Communication  

Bluetooth® low energy Ver.4.2
Including central and peripheral functions

CPU  

Arm® Cortex®-M0

Transmitter output power   0 dBm to -20 dBm (4 dB steps)
Receiver sensitivity   -93.0 dBm
Profiles   HCI, GATT (Generic Attribute Profile), including server and client functions
Interfaces   UART, I2C, SPI, GPIO
Other features  

DC-DC Converter
Low drop regulator
General purpose ADC
User program function
Wake up signal for host device
PWM function

 

Notes:
[1]: Low power consumption communication technology defined in Bluetooth® Ver.4.2.
[2]: Qualification is expected by the end of the year.

 

*The Bluetooth® word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc. and any use of such marks by Toshiba is under license. Other trademarks and trade names are those of their respective owners.”

 

*Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

 

For more information about the new product, please visit:
https://toshiba.semicon-storage.com/info/lookup.jsp?pid=TC35679IFTG-002&region=apc&lang=en

 

For more information about the line-up of Bluetooth® wireless communication ICs, please visit:
https://toshiba.semicon-storage.com/ap-en/product/wireless-communication/bluetooth.html

 

Customer Inquiries:
Mixed Signal IC Sales and Marketing Department
Tel: +81-44-548-2876
https://toshiba.semicon-storage.com/ap-en/contact.html

 

*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

 

About Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation combines the vigor of a new company with the wisdom of experience. Since being spun off from Toshiba Corporation in July 2017, we have taken our place among the leading general devices companies, and offer our customers and business partners outstanding solutions in discrete semiconductors, system LSIs and HDD.

 

Our 19,000 employees around the world share a determination to maximize the value of our products, and emphasize close collaboration with customers to promote co-creation of value and new markets. We look forward to building on annual sales now surpassing 700-billion yen (US$6 billion) and to contributing to a better future for people everywhere.
Find out more about us at https://toshiba.semicon-storage.com/ap-en/company.html

 

 

 

 
MULTIMEDIA AVAILABLE :
http://www.businesswire.com/news/home/20171205006519/en/


Click here for Media Contact Details
CONTACTS :

Media Inquiries:
Toshiba Electronic Devices & Storage Corporation
Chiaki Nagasawa, +81-3-3457-4963
Digital Marketing Department
semicon-NR-mailbox@ml.toshiba.co.jp


More News from Toshiba Electronic Devices & Storage Corporation

09/12/2017 1:00PM

Toshiba Electronic Devices & Storage Corporation Launches World's First 14TB HDD with Conventional Magnetic Recording

Toshiba Electronic Devices & Storage Corporation announced the launch of the MG07ACA Series, the world’s first[1] enterprise 14TB[2] Conventional Magnetic Recording (CMR) HDD. Using a 9-disk, helium-sealed ...

08/12/2017 5:45PM Image

तोशिबा इलेक्ट्रॉनिक डिवाईसेस एवं स्टोरेज कॉर्पोरेशन ने कार ऑडियो के लिए 4-चैनल उच्‍च दक्षता लीनियर पावर एम्‍प्‍लीफायर की पेशकश की

तोशिबा इलेक्‍ट्रॉनिक डिवाइसेस एंड स्‍टोरेज कॉर्पोरेशन ने आज नये 4-चैनल उच्‍च दक्षता वाले लीनियर पावर एम्‍प्‍लीफायर "टीसीबी701एफएनजी" की पेशकश करने की घोषणा की है। यह एम्‍प्‍लीफायर ...

08/12/2017 5:05PM

Toshiba Electronic Devices & Storage Corporation Launches 4-channel High-Efficiency Linear Power Amplifier for Car Audio

Toshiba Electronic Devices & Storage Corporation announced a new 4-channel high-efficiency linear power amplifier "TCB701FNG," that meets current market requirement for high efficiency. Sample shipments ...

Similar News

11/12/2017 7:05PM

Valence Advises SK Capital on Its Acquisition of ICL's Fire Safety and Oil Additives Businesses

The Valence Group acted as lead financial advisor to SK Capital Partners on its announced acquisition of the Fire Safety and Oil Additives businesses of Israel Chemicals Ltd. (“ICL”) for approximately $1 ...

No Image

11/12/2017 6:45PM

Ebix's Travel Exchange, Via.com Launches the Biggest Online Travel Sale: BOTS 2017

EbixCash, India's leading Financial Exchange and an initiative of Ebix, Inc. (NASDAQ: EBIX), today announced the launch of 'The Biggest Online Travel Sale' through its Travel Exchange Via.com. The 8-day sale will ...